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Chemical content PMEG3020EGW

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Type numberPackagePackage descriptionTotal product weight
PMEG3020EGWSOD123SOD212.21330 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934070367118312601235Dongguan, China; Seremban, Malaysia; D-22529 HAMBURG, Germany 
934070367115212601235Seremban, Malaysia; Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.16000100.000001.31005
subTotal0.16000100.000001.31005
Lead FrameCopper alloyCopper (Cu)7440-50-83.5331894.4700028.92894
Iron (Fe)7439-89-60.077792.080000.63694
Phosphorus (P)7723-14-00.001500.040000.01225
Zinc (Zn)7440-66-60.004860.130000.03981
Pure metal layerCopper (Cu)7440-50-80.062461.670000.51139
Silver (Ag)7440-22-40.060211.610000.49302
subTotal3.74000100.0000030.62235
Mould CompoundAdditiveNon hazardousProprietary0.234032.900001.91619
Triphenylphosphine603-35-00.004040.050000.03304
FillerSilica -amorphous-7631-86-95.8104072.0000047.57437
PigmentCarbon black1333-86-40.004040.050000.03304
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.2105015.000009.91133
Phenol Formaldehyde resin (generic)9003-35-40.8070010.000006.60755
subTotal8.07000100.0000066.07552
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00008
Non hazardousProprietary0.000120.055500.00095
Tin solderTin (Sn)7440-31-50.2098799.940001.71841
subTotal0.21000100.000001.71944
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0332599.990000.27222
subTotal0.03325100.000000.27225
total12.21330100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.