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Chemical content PMEG3020EPA

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMEG3020EPASOT1061HUSON37.66345 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934063485115812601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001101.000000.01435
FillerSilver (Ag)7440-22-40.0924084.000001.20572
PolymerBismaleimidodiphenylmethane resin 0.0110010.000000.14354
Isobornyl Methacrylate7534-94-30.005505.000000.07177
subTotal0.11000100.000001.43538
DieDoped siliconSilicon (Si)7440-21-30.31000100.000004.04518
subTotal0.31000100.000004.04518
Lead FrameCopper alloyCopper (Cu)7440-50-82.5800192.9400033.66649
Magnesium (Mg)7439-95-40.004720.170000.06158
Nickel (Ni)7440-02-00.086063.100001.12294
Silicon (Si)7440-21-30.019430.700000.25357
Pure metal layerGold (Au)7440-57-50.001110.040000.01449
Nickel (Ni)7440-02-00.077452.790001.01065
Palladium (Pd)7440-05-30.007220.260000.09418
subTotal2.77600100.0000036.22390
Mould CompoundAdditiveNon hazardousProprietary0.017470.410000.22791
FillerSilica -amorphous-7631-86-90.012350.290000.16121
Silica fused60676-86-03.6699986.1500047.88953
HardenerPhenolic resinProprietary0.182754.290002.38475
PigmentCarbon black1333-86-40.008090.190000.10562
PolymerEpoxy resin systemProprietary0.369348.670004.81953
subTotal4.26000100.0000055.58855
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00123
Tin solderTin (Sn)7440-31-50.1699099.940002.21699
subTotal0.17000100.000002.21832
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalCopper (Cu)7440-50-80.0374599.990000.48863
subTotal0.03745100.000000.48868
total7.66345100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.