Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMEG4002ELD

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMEG4002ELDSOD882DDFN1006-20.660600 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340653393155126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00228076.0000000.345141
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00031410.4700000.047548
Phenolic resinProprietary0.00040613.5300000.061444
subTotal0.003000100.0000000.454133
DieDoped siliconSilicon (Si)7440-21-30.020000100.0000003.027551
subTotal0.020000100.0000003.027551
Lead FrameCopper alloyChromium (Cr)7440-47-30.0008030.2575000.121617
Copper (Cu)7440-50-80.29576094.79500044.771480
Tin (Sn)7440-31-50.0007450.2388000.112785
Zinc (Zn)7440-66-60.0005950.1908000.090114
Pure metal layerGold (Au)7440-57-50.0001720.0550000.025976
Nickel (Ni)7440-02-00.0133914.2920002.027103
Palladium (Pd)7440-05-30.0005330.1709000.080716
subTotal0.312000100.00000047.229791
Mould CompoundFillerSilica -amorphous-7631-86-90.06877023.00000010.410233
Silica fused60676-86-00.17940060.00000027.157130
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0089703.0000001.357856
Ion trapping agentBismuth (Bi)7440-69-90.0014950.5000000.226309
PigmentCarbon black1333-86-40.0014950.5000000.226309
PolymerEpoxy resin systemProprietary0.0209307.0000003.168332
Phenolic resinProprietary0.0179406.0000002.715713
subTotal0.299000100.00000045.261883
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000150
Non hazardousProprietary0.0000120.0555000.001848
Tin solderTin (Sn)7440-31-50.02198799.9400003.328308
subTotal0.022000100.0000003.330306
WireImpurityNon hazardousProprietary0.0000000.0100000.000070
Pure metalGold (Au)7440-57-50.00464099.9900000.702322
subTotal0.004640100.0000000.702392
total0.660600100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.