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Chemical content PMEG4010BEA

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Type numberPackagePackage descriptionTotal product weight
PMEG4010BEASOD323SOD24.56628 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934057918135812601235Seremban, Malaysia; Dongguan, China; D-22529 HAMBURG, Germany 
9340579181151912601235D-22529 HAMBURG, Germany; Seremban, Malaysia; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.12000100.000002.62796
subTotal0.12000100.000002.62796
Lead FrameCopper alloyCopper (Cu)7440-50-81.2190795.9900026.69729
Iron (Fe)7439-89-60.032642.570000.71478
Lead (Pb)7439-92-10.000380.030000.00834
Phosphorus (P)7723-14-00.001900.150000.04172
Zinc (Zn)7440-66-60.002540.200000.05563
Pure metal layerSilver (Ag)7440-22-40.013461.060000.29481
subTotal1.27000100.0000027.81257
Mould CompoundAdditiveNon hazardousProprietary0.088452.900001.93703
Triphenylphosphine603-35-00.001520.050000.03340
FillerSilica -amorphous-7631-86-92.1960072.0000048.09166
PigmentCarbon black1333-86-40.001520.050000.03340
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.4575015.0000010.01910
Phenol Formaldehyde resin (generic)9003-35-40.3050010.000006.67940
subTotal3.05000100.0000066.79399
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00011
Non hazardousProprietary0.000060.055500.00134
Tin solderTin (Sn)7440-31-50.1099399.940002.40752
subTotal0.11000100.000002.40897
WireImpurityNon hazardousProprietary0.000000.010000.00004
Pure metalCopper (Cu)7440-50-80.0162799.990000.35638
subTotal0.01628100.000000.35642
total4.56628100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.