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Chemical content PMEG4010EP-Q

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Type numberPackagePackage descriptionTotal product weight
PMEG4010EP-QSOD128FlatPower32.46600 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934662873115112601235Seremban, Malaysia; Suzhou, China; D-22529 HAMBURG, GermanyLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.36900100.000001.13657
subTotal0.36900100.000001.13657
ClipCopper alloyCopper (Cu)7440-50-85.2098599.8630016.04710
Iron (Fe)7439-89-60.005160.099000.01591
Phosphorus (P)7723-14-00.001980.038000.00611
subTotal5.21700100.0000016.06912
Lead FrameCopper alloyCopper (Cu)7440-50-811.8046399.8700036.35999
Iron (Fe)7439-89-60.011230.095000.03459
Phosphorus (P)7723-14-00.004140.035000.01274
subTotal11.82000100.0000036.40732
Mould CompoundFillerSilica -amorphous-7631-86-91.2210010.000003.76086
Silica fused60676-86-09.1575075.0000028.20643
PigmentCarbon black1333-86-40.036630.300000.11283
PolymerEpoxy resin systemProprietary0.940177.700002.89586
Phenolic resinProprietary0.854707.000002.63260
subTotal12.21000100.0000037.60858
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00003
Bismuth (Bi)7440-69-90.000000.001000.00001
Copper (Cu)7440-50-80.000000.001000.00001
Lead (Pb)7439-92-10.000020.005000.00005
Tin solderTin (Sn)7440-31-50.3499699.990001.07794
subTotal0.35000100.000001.07804
Solder PasteLead alloyLead (Pb)7439-92-12.3125092.500007.12284
Silver alloySilver (Ag)7440-22-40.062502.500000.19251
Tin alloyTin (Sn)7440-31-50.125005.000000.38502
subTotal2.50000100.000007.70037
total32.46600100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.