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Chemical content PMEG4010EPK

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMEG4010EPKSOD1608SOD16081.82808 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934065384315812601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000201.000000.01094
FillerSilver (Ag)7440-22-40.0168084.000000.91900
PolymerBismaleimidodiphenylmethane resin 0.0020010.000000.10940
Isobornyl Methacrylate7534-94-30.001005.000000.05470
subTotal0.02000100.000001.09404
DieDoped siliconSilicon (Si)7440-21-30.07000100.000003.82915
subTotal0.07000100.000003.82915
Lead FrameCopper alloyCopper (Cu)7440-50-80.9970393.1800054.53952
Magnesium (Mg)7439-95-40.001500.140000.08194
Nickel (Ni)7440-02-00.031032.900001.69741
Silicon (Si)7440-21-30.006740.630000.36875
Pure metal layerGold (Au)7440-57-50.000540.050000.02927
Nickel (Ni)7440-02-00.030282.830001.65644
Palladium (Pd)7440-05-30.002890.270000.15803
subTotal1.07000100.0000058.53136
Mould CompoundFillerSilica -amorphous-7631-86-90.1242023.000006.79401
Silica fused60676-86-00.3240060.0000017.72351
Flame retardantMetal hydroxideProprietary0.016203.000000.88618
ImpurityBismuth (Bi)7440-69-90.002700.500000.14770
PigmentCarbon black1333-86-40.002700.500000.14770
PolymerEpoxy resin systemProprietary0.037807.000002.06774
Phenolic resinProprietary0.032406.000001.77235
subTotal0.54000100.0000029.53919
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00022
Non hazardousProprietary0.000050.055500.00273
Tin solderTin (Sn)7440-31-50.0899599.940004.92024
subTotal0.09000100.000004.92319
WireImpurityNon hazardousProprietary0.000000.010000.00021
Pure metalGold (Au)7440-57-50.0380899.990002.08285
subTotal0.03808100.000002.08306
total1.82808100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.