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Chemical content PMEG4015EPK

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMEG4015EPKSOD1608SOD16081.85808 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934065385315812601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000201.000000.01076
FillerSilver (Ag)7440-22-40.0168084.000000.90416
PolymerBismaleimidodiphenylmethane resin 0.0020010.000000.10764
Isobornyl Methacrylate7534-94-30.001005.000000.05382
subTotal0.02000100.000001.07638
DieDoped siliconSilicon (Si)7440-21-30.10000100.000005.38190
subTotal0.10000100.000005.38190
Lead FrameCopper alloyCopper (Cu)7440-50-80.9970393.1800053.65894
Magnesium (Mg)7439-95-40.001500.140000.08062
Nickel (Ni)7440-02-00.031032.900001.67000
Silicon (Si)7440-21-30.006740.630000.36279
Pure metal layerGold (Au)7440-57-50.000540.050000.02879
Nickel (Ni)7440-02-00.030282.830001.62969
Palladium (Pd)7440-05-30.002890.270000.15548
subTotal1.07000100.0000057.58631
Mould CompoundFillerSilica -amorphous-7631-86-90.1242023.000006.68432
Silica fused60676-86-00.3240060.0000017.43735
Flame retardantMetal hydroxideProprietary0.016203.000000.87187
ImpurityBismuth (Bi)7440-69-90.002700.500000.14531
PigmentCarbon black1333-86-40.002700.500000.14531
PolymerEpoxy resin systemProprietary0.037807.000002.03436
Phenolic resinProprietary0.032406.000001.74374
subTotal0.54000100.0000029.06226
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00022
Non hazardousProprietary0.000050.055500.00269
Tin solderTin (Sn)7440-31-50.0899599.940004.84080
subTotal0.09000100.000004.84371
WireImpurityNon hazardousProprietary0.000000.010000.00020
Pure metalGold (Au)7440-57-50.0380899.990002.04922
subTotal0.03808100.000002.04942
total1.85808100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.