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Chemical content PMEG40T30EP

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Type numberPackagePackage descriptionTotal product weight
PMEG40T30EPSOD128FlatPower33.89000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934070406115312601235D-22529 HAMBURG, Germany; Seremban, MalaysiaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.61000100.000001.79994
subTotal0.61000100.000001.79994
ClipCopper alloyCopper (Cu)7440-50-87.2805299.8700021.48281
Iron (Fe)7439-89-60.007290.100000.02151
Phosphorus (P)7723-14-00.002190.030000.00645
subTotal7.29000100.0000021.51077
Lead FrameCopper alloyCopper (Cu)7440-50-811.6332498.4200034.32648
Iron (Fe)7439-89-60.011820.100000.03488
Phosphorus (P)7723-14-00.003550.030000.01046
Pure metal layerSilver (Ag)7440-22-40.171391.450000.50572
subTotal11.82000100.0000034.87754
Mould CompoundFillerSilica fused60676-86-08.0372071.0000023.71555
PigmentCarbon black1333-86-40.033960.300000.10021
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-22.2300419.700006.58023
Phenolic resinProprietary1.018809.000003.00620
subTotal11.32000100.0000033.40219
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00003
Bismuth (Bi)7440-69-90.000000.001000.00001
Copper (Cu)7440-50-80.000000.001000.00001
Lead (Pb)7439-92-10.000020.005000.00005
Tin solderTin (Sn)7440-31-50.3499699.990001.03265
subTotal0.35000100.000001.03275
Solder PasteLead alloyLead (Pb)7439-92-12.3125092.500006.82355
Silver alloySilver (Ag)7440-22-40.062502.500000.18442
Tin alloyTin (Sn)7440-31-50.125005.000000.36884
subTotal2.50000100.000007.37681
total33.89000100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.