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Chemical content PMEG40T50EP

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Type numberPackagePackage descriptionTotal product weight
PMEG40T50EPSOD128FlatPower34.19000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934070407115312601235Seremban, Malaysia; D-22529 HAMBURG, GermanyLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.91000100.000002.66160
subTotal0.91000100.000002.66160
ClipCopper alloyCopper (Cu)7440-50-87.2805299.8700021.29431
Iron (Fe)7439-89-60.007290.100000.02132
Phosphorus (P)7723-14-00.002190.030000.00640
subTotal7.29000100.0000021.32203
Lead FrameCopper alloyCopper (Cu)7440-50-811.6332498.4200034.02528
Iron (Fe)7439-89-60.011820.100000.03457
Phosphorus (P)7723-14-00.003550.030000.01037
Pure metal layerSilver (Ag)7440-22-40.171391.450000.50129
subTotal11.82000100.0000034.57151
Mould CompoundFillerSilica fused60676-86-08.0372071.0000023.50746
PigmentCarbon black1333-86-40.033960.300000.09933
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-22.2300419.700006.52249
Phenolic resinProprietary1.018809.000002.97982
subTotal11.32000100.0000033.10910
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00003
Bismuth (Bi)7440-69-90.000000.001000.00001
Copper (Cu)7440-50-80.000000.001000.00001
Lead (Pb)7439-92-10.000020.005000.00005
Tin solderTin (Sn)7440-31-50.3499699.990001.02359
subTotal0.35000100.000001.02369
Solder PasteLead alloyLead (Pb)7439-92-12.3125092.500006.76367
Silver alloySilver (Ag)7440-22-40.062502.500000.18280
Tin alloyTin (Sn)7440-31-50.125005.000000.36560
subTotal2.50000100.000007.31207
total34.19000100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.