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Chemical content PMEG6002ELD

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMEG6002ELDSOD882DDFN1006-20.68060 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934067662315212601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0022876.000000.33500
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0003110.470000.04615
Phenolic resinProprietary0.0004113.530000.05964
subTotal0.00300100.000000.44079
DieDoped siliconSilicon (Si)7440-21-30.04000100.000005.87717
subTotal0.04000100.000005.87717
Lead FrameCopper alloyChromium (Cr)7440-47-30.000800.257500.11804
Copper (Cu)7440-50-80.2957694.7950043.45583
Tin (Sn)7440-31-50.000750.238800.10947
Zinc (Zn)7440-66-60.000600.190800.08747
Pure metal layerGold (Au)7440-57-50.000170.055000.02521
Nickel (Ni)7440-02-00.013394.292001.96753
Palladium (Pd)7440-05-30.000530.170900.07834
subTotal0.31200100.0000045.84189
Mould CompoundFillerSilica -amorphous-7631-86-90.0687723.0000010.10432
Silica fused60676-86-00.1794060.0000026.35909
Flame retardantMetal hydroxideProprietary0.008973.000001.31795
ImpurityBismuth (Bi)7440-69-90.001500.500000.21966
PigmentCarbon black1333-86-40.001500.500000.21966
PolymerEpoxy resin systemProprietary0.020937.000003.07523
Phenolic resinProprietary0.017946.000002.63591
subTotal0.29900100.0000043.93182
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00015
Non hazardousProprietary0.000010.055500.00179
Tin solderTin (Sn)7440-31-50.0219999.940003.23050
subTotal0.02200100.000003.23244
WireImpurityNon hazardousProprietary0.000000.010000.00007
Pure metalGold (Au)7440-57-50.0046499.990000.68168
subTotal0.00464100.000000.68175
total0.68060100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.