×

Chemical content PMEG6010CPAS

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMEG6010CPASSOT1061DHUSON37.95691 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934068147115312601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001101.000000.01382
FillerSilver (Ag)7440-22-40.0924084.000001.16125
PolymerBismaleimidodiphenylmethane resin 0.0110010.000000.13824
Isobornyl Methacrylate7534-94-30.005505.000000.06912
subTotal0.11000100.000001.38243
DieDoped siliconSilicon (Si)7440-21-30.59000100.000007.41494
subTotal0.59000100.000007.41494
Lead FrameCopper alloyCopper (Cu)7440-50-82.6312793.8400033.06904
Magnesium (Mg)7439-95-40.014020.500000.17620
Nickel (Ni)7440-02-00.103753.700001.30387
Silicon (Si)7440-21-30.022430.800000.28192
Pure metal layerGold (Au)7440-57-50.001680.060000.02114
Nickel (Ni)7440-02-00.028041.000000.35240
Palladium (Pd)7440-05-30.002800.100000.03524
subTotal2.80400100.0000035.23981
Mould CompoundAdditiveNon hazardousProprietary0.017470.410000.21951
FillerSilica -amorphous-7631-86-90.012350.290000.15526
Silica fused60676-86-03.6699986.1500046.12331
HardenerPhenolic resinProprietary0.182754.290002.29680
PigmentCarbon black1333-86-40.008090.190000.10172
PolymerEpoxy resin systemProprietary0.369348.670004.64178
subTotal4.26000100.0000053.53838
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00119
Tin solderTin (Sn)7440-31-50.1699099.940002.13523
subTotal0.17000100.000002.13652
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0229099.990000.28784
subTotal0.02291100.000000.28787
total7.95691100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.