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Chemical content PMEG6020EPA

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Type numberPackagePackage descriptionTotal product weight
PMEG6020EPASOT1061HUSON37.93698 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934063487135212601235D-22529 HAMBURG, Germany; Dongguan, China 
934063487115912601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001101.000000.01386
FillerSilver (Ag)7440-22-40.0924084.000001.16417
PolymerBismaleimidodiphenylmethane resin 0.0110010.000000.13859
Isobornyl Methacrylate7534-94-30.005505.000000.06930
subTotal0.11000100.000001.38592
DieDoped siliconSilicon (Si)7440-21-30.59000100.000007.43356
subTotal0.59000100.000007.43356
Lead FrameCopper alloyCopper (Cu)7440-50-82.5800192.9400032.50625
Magnesium (Mg)7439-95-40.004720.170000.05946
Nickel (Ni)7440-02-00.086063.100001.08424
Silicon (Si)7440-21-30.019430.700000.24483
Pure metal layerGold (Au)7440-57-50.001110.040000.01399
Nickel (Ni)7440-02-00.077452.790000.97582
Palladium (Pd)7440-05-30.007220.260000.09094
subTotal2.77600100.0000034.97553
Mould CompoundAdditiveNon hazardousProprietary0.017470.410000.22006
FillerSilica -amorphous-7631-86-90.012350.290000.15565
Silica fused60676-86-03.6699986.1500046.23912
HardenerPhenolic resinProprietary0.182754.290002.30256
PigmentCarbon black1333-86-40.008090.190000.10198
PolymerEpoxy resin systemProprietary0.369348.670004.65343
subTotal4.26000100.0000053.67280
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00119
Tin solderTin (Sn)7440-31-50.1699099.940002.14059
subTotal0.17000100.000002.14188
WireImpurityNon hazardousProprietary0.000000.010000.00004
Pure metalCopper (Cu)7440-50-80.0309799.990000.39022
subTotal0.03098100.000000.39026
total7.93698100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.