Chemical content PMEG6020ER

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Type numberPackagePackage descriptionTotal product weight
PMEG6020ERSOD123W SOD123FLSOD216.90800 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9340614641151012601235D-22529 HAMBURG, Germany; Seremban, Malaysia; Suzhou, ChinaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.67100100.000003.96854
ClipCopper alloyCopper (Cu)7440-50-83.1752399.8500018.77945
Iron (Fe)7439-89-60.003820.120000.02257
Phosphorus (P)7723-14-00.000950.030000.00564
Lead FrameCopper alloyCopper (Cu)7440-50-85.4125799.8630032.01192
Iron (Fe)7439-89-60.005310.098000.03141
Phosphorus (P)7723-14-00.001950.036000.01154
Pure metal layerCopper (Cu)7440-50-80.000160.003000.00096
Mould CompoundFillerSilica -amorphous-7631-86-90.6930010.000004.09865
Silica fused60676-86-05.1975075.0000030.73989
PigmentCarbon black1333-86-40.020790.300000.12296
PolymerEpoxy resin systemProprietary0.533617.700003.15596
Phenolic resinProprietary0.485107.000002.86906
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00002
Bismuth (Bi)7440-69-90.000000.001000.00001
Copper (Cu)7440-50-80.000000.001000.00001
Lead (Pb)7439-92-10.000000.005000.00003
Tin solderTin (Sn)7440-31-50.0999999.990000.59138
Solder PasteLead alloyLead (Pb)7439-92-10.5614892.500003.32077
Silver alloySilver (Ag)7440-22-40.015182.500000.08975
Tin alloyTin (Sn)7440-31-50.030355.000000.17950
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.