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Chemical content PMEG60T20ELP

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Type numberPackagePackage descriptionTotal product weight
PMEG60T20ELPSOD128FlatPower32.60100 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934070875115512601235Seremban, Malaysia; D-22529 HAMBURG, GermanyLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.50400100.000001.54596
subTotal0.50400100.000001.54596
ClipCopper alloyCopper (Cu)7440-50-85.2097099.8600015.98017
Iron (Fe)7439-89-60.005220.100000.01600
Phosphorus (P)7723-14-00.002090.040000.00640
subTotal5.21700100.0000016.00257
Lead FrameCopper alloyCopper (Cu)7440-50-811.6332498.4200035.68370
Iron (Fe)7439-89-60.011820.100000.03626
Phosphorus (P)7723-14-00.003550.030000.01088
Pure metal layerSilver (Ag)7440-22-40.171391.450000.52572
subTotal11.82000100.0000036.25656
Mould CompoundFillerSilica -amorphous-7631-86-91.2210010.000003.74528
Silica fused60676-86-09.1575075.0000028.08963
PigmentCarbon black1333-86-40.036630.300000.11236
PolymerEpoxy resin systemProprietary0.940177.700002.88387
Phenolic resinProprietary0.854707.000002.62170
subTotal12.21000100.0000037.45284
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00003
Bismuth (Bi)7440-69-90.000000.001000.00001
Copper (Cu)7440-50-80.000000.001000.00001
Lead (Pb)7439-92-10.000020.005000.00005
Tin solderTin (Sn)7440-31-50.3499699.990001.07348
subTotal0.35000100.000001.07358
Solder PasteLead alloyLead (Pb)7439-92-12.3125092.500007.09334
Silver alloySilver (Ag)7440-22-40.062502.500000.19171
Tin alloyTin (Sn)7440-31-50.125005.000000.38342
subTotal2.50000100.000007.66847
total32.60100100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.