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Chemical content PMEG60T20ELR

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Type numberPackagePackage descriptionTotal product weight
PMEG60T20ELRSOD123WSOD217.01400 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934070786115512601235Seremban, Malaysia; D-22529 HAMBURG, GermanyLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.50400100.000002.96227
subTotal0.50400100.000002.96227
ClipCopper alloyCopper (Cu)7440-50-83.1752399.8500018.66245
Iron (Fe)7439-89-60.003820.120000.02243
Phosphorus (P)7723-14-00.000950.030000.00561
subTotal3.18000100.0000018.69049
Lead FrameCopper alloyCopper (Cu)7440-50-85.4156798.1100031.83068
Iron (Fe)7439-89-60.005520.100000.03244
Phosphorus (P)7723-14-00.001660.030000.00973
Pure metal layerSilver (Ag)7440-22-40.097151.760000.57101
subTotal5.52000100.0000032.44386
Mould CompoundFillerSilica -amorphous-7631-86-90.6680010.000003.92618
Silica fused60676-86-05.0100075.0000029.44634
PigmentCarbon black1333-86-40.020040.300000.11779
PolymerEpoxy resin systemProprietary0.514367.700003.02316
Phenolic resinProprietary0.467607.000002.74832
subTotal6.68000100.0000039.26179
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00003
Bismuth (Bi)7440-69-90.000000.001000.00001
Copper (Cu)7440-50-80.000000.001000.00001
Lead (Pb)7439-92-10.000010.005000.00005
Tin solderTin (Sn)7440-31-50.1599899.990000.94031
subTotal0.16000100.000000.94041
Solder PasteLead alloyLead (Pb)7439-92-10.8972592.500005.27360
Silver alloySilver (Ag)7440-22-40.024252.500000.14253
Tin alloyTin (Sn)7440-31-50.048505.000000.28506
subTotal0.97000100.000005.70119
total17.01400100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.