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Chemical content PMEG60T30ELR

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Type numberPackagePackage descriptionTotal product weight
PMEG60T30ELRSOD123WSOD217.30000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934070787115512601235D-22529 HAMBURG, Germany; Seremban, MalaysiaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.74000100.000004.27746
subTotal0.74000100.000004.27746
ClipCopper alloyCopper (Cu)7440-50-83.1752399.8500018.35393
Iron (Fe)7439-89-60.003820.120000.02206
Phosphorus (P)7723-14-00.000950.030000.00551
subTotal3.18000100.0000018.38150
Lead FrameCopper alloyCopper (Cu)7440-50-85.4156798.1100031.30446
Iron (Fe)7439-89-60.005520.100000.03191
Phosphorus (P)7723-14-00.001660.030000.00957
Pure metal layerSilver (Ag)7440-22-40.097151.760000.56157
subTotal5.52000100.0000031.90751
Mould CompoundFillerSilica -amorphous-7631-86-90.6680010.000003.86127
Silica fused60676-86-05.0100075.0000028.95954
PigmentCarbon black1333-86-40.020040.300000.11584
PolymerEpoxy resin systemProprietary0.514367.700002.97318
Phenolic resinProprietary0.467607.000002.70289
subTotal6.68000100.0000038.61272
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00003
Bismuth (Bi)7440-69-90.000000.001000.00001
Copper (Cu)7440-50-80.000000.001000.00001
Lead (Pb)7439-92-10.000010.005000.00005
Tin solderTin (Sn)7440-31-50.1599899.990000.92476
subTotal0.16000100.000000.92486
Solder PasteLead alloyLead (Pb)7439-92-10.8972592.500005.18642
Silver alloySilver (Ag)7440-22-40.024252.500000.14017
Tin alloyTin (Sn)7440-31-50.048505.000000.28035
subTotal0.97000100.000005.60694
total17.30000100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.