×

Chemical content PMH850UPE

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMH850UPESOT8001DFN0606-30.45510 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935690961125412601235Kwai Chung, Hong Kong; Hsin-chu, Taiwan; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveFormaldehyde/phenol/m-xylene copolymer67784-74-10.000728.000000.15821
FillerSilver (Ag)7440-22-40.0077486.000001.70073
PolymerBisphenol A-epichlorohydrin resin25068-38-60.000091.000000.01978
Bisphenol-A Bisphenol-A Diglycidyl Ether copolymer25036-25-30.000455.000000.09888
subTotal0.00900100.000001.97760
DieDoped siliconSilicon (Si)7440-21-30.04000100.000008.78928
subTotal0.04000100.000008.78928
Lead FrameCopper alloyCopper (Cu)7440-50-80.1768093.5473038.84957
Magnesium (Mg)7439-95-40.000280.145900.06059
Nickel (Ni)7440-02-00.005512.917301.21154
Silicon (Si)7440-21-30.001190.632100.26251
Pure metal layerGold (Au)7440-57-50.000110.057500.02388
Nickel (Ni)7440-02-00.004762.518101.04575
Palladium (Pd)7440-05-30.000340.181800.07550
subTotal0.18900100.0000041.52934
Mould CompoundFillerSilica -amorphous-7631-86-90.0485323.0000010.66359
Silica fused60676-86-00.1266060.0000027.81806
Flame retardantMetal hydroxideProprietary0.006333.000001.39090
ImpurityBismuth (Bi)7440-69-90.001060.500000.23182
PigmentCarbon black1333-86-40.001060.500000.23182
PolymerEpoxy resin systemProprietary0.014777.000003.24544
Phenolic resinProprietary0.012666.000002.78181
subTotal0.21100100.0000046.36344
WireImpurityNon hazardousProprietary0.000000.010000.00013
Pure metalGold (Au)7440-57-50.0061099.990001.34023
subTotal0.00610100.000001.34036
total0.45510100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.