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Chemical content PMN30XPA

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Type numberPackagePackage descriptionTotal product weight
PMN30XPASOT457SC-7412.41253 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934661109115412601235Kuching Sarawak, Malaysia; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0523677.000000.42183
PolymerResin systemProprietary0.0156423.000000.12600
subTotal0.06800100.000000.54783
DieDoped siliconSilicon (Si)7440-21-30.28000100.000002.25579
subTotal0.28000100.000002.25579
Lead FrameCopper alloyCopper (Cu)7440-50-84.5044095.1700036.28911
Iron (Fe)7439-89-60.107442.270000.86557
Phosphorus (P)7723-14-00.003310.070000.02669
Zinc (Zn)7440-66-60.005680.120000.04576
Pure metal layerSilver (Ag)7440-22-40.112172.370000.90370
subTotal4.73300100.0000038.13083
Mould CompoundFillerSilica -amorphous-7631-86-92.3661735.0700019.06278
Silica fused60676-86-02.9578843.8400023.82983
PigmentCarbon black1333-86-40.016870.250000.13589
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.6747010.000005.43564
Phenol Formaldehyde resin (generic)9003-35-40.670659.940005.40302
Polyethylene (PE) -wax-9002-88-40.060720.900000.48921
subTotal6.74700100.0000054.35637
Post-PlatingImpurityLead (Pb)7439-92-10.000020.004500.00018
Non hazardousProprietary0.000270.055500.00217
Tin solderTin (Sn)7440-31-50.4857199.940003.91305
subTotal0.48600100.000003.91540
WireImpurityNon hazardousProprietary0.000010.010000.00008
Pure metalCopper (Cu)7440-50-80.0985299.990000.79368
subTotal0.09852100.000000.79376
total12.41253100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.