×

Chemical content PMP4501QAS

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMP4501QASSOT1216DFN1010B-61.21435 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934660012147312601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000221.000000.01812
FillerSilver (Ag)7440-22-40.0184884.000001.52180
PolymerBismaleimidodiphenylmethane resin 0.0022010.000000.18117
Isobornyl Methacrylate7534-94-30.001105.000000.09058
subTotal0.02200100.000001.81167
DieDoped siliconSilicon (Si)7440-21-30.06000100.000004.94091
subTotal0.06000100.000004.94091
Lead FrameCopper alloyCopper (Cu)7440-50-80.4476991.1800036.86695
Magnesium (Mg)7439-95-40.000830.170000.06874
Nickel (Ni)7440-02-00.013942.840001.14830
Silicon (Si)7440-21-30.003040.620000.25069
Pure metal layerGold (Au)7440-57-50.000340.070000.02830
Nickel (Ni)7440-02-00.023034.690001.89631
Palladium (Pd)7440-05-30.002110.430000.17386
subTotal0.49100100.0000040.43315
Mould CompoundFillerSilica -amorphous-7631-86-90.1393823.0000011.47775
Silica fused60676-86-00.3636060.0000029.94194
Flame retardantMetal hydroxideProprietary0.018183.000001.49710
ImpurityBismuth (Bi)7440-69-90.003030.500000.24952
PigmentCarbon black1333-86-40.003030.500000.24952
PolymerEpoxy resin systemProprietary0.042427.000003.49323
Phenolic resinProprietary0.036366.000002.99419
subTotal0.60600100.0000049.90325
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00009
Non hazardousProprietary0.000010.055500.00110
Tin solderTin (Sn)7440-31-50.0239999.940001.97518
subTotal0.02400100.000001.97637
WireImpurityNon hazardousProprietary0.000000.010000.00009
Pure metalGold (Au)7440-57-50.0113499.990000.93423
subTotal0.01135100.000000.93432
total1.21435100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.