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Chemical content PMPB07R0UN

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Type numberPackagePackage descriptionTotal product weight
PMPB07R0UNSOT1220-2DFN2020M-67.12315 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934661977184112601235Dongguan, China; Kuching Sarawak, Malaysia 
934661977115212601235Kuching Sarawak, Malaysia; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001161.000000.01628
FillerSilver (Ag)7440-22-40.0974484.000001.36793
PolymerBismaleimidodiphenylmethane resin 0.0116010.000000.16285
Isobornyl Methacrylate7534-94-30.005805.000000.08142
subTotal0.11600100.000001.62848
DieDoped siliconSilicon (Si)7440-21-30.51000100.000007.15975
subTotal0.51000100.000007.15975
Lead FrameCopper alloyCopper (Cu)7440-50-82.6919895.6300037.79205
Magnesium (Mg)7439-95-40.004220.150000.05928
Nickel (Ni)7440-02-00.083892.980001.17767
Silicon (Si)7440-21-30.018300.650000.25687
Pure metal layerGold (Au)7440-57-50.000280.010000.00395
Nickel (Ni)7440-02-00.015480.550000.21735
Palladium (Pd)7440-05-30.000840.030000.01186
subTotal2.81500100.0000039.51903
Mould CompoundFillerSilica -amorphous-7631-86-90.8277723.0000011.62084
Silica fused60676-86-02.1594060.0000030.31524
Flame retardantMetal hydroxideProprietary0.107973.000001.51576
ImpurityBismuth (Bi)7440-69-90.018000.500000.25263
PigmentCarbon black1333-86-40.018000.500000.25263
PolymerEpoxy resin systemProprietary0.251937.000003.53678
Phenolic resinProprietary0.215946.000003.03152
subTotal3.59900100.0000050.52540
WireImpurityNon hazardousProprietary0.000010.010000.00012
Pure metalCopper (Cu)7440-50-80.0831499.990001.16722
subTotal0.08315100.000001.16734
total7.12315100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.