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Chemical content PMPB07R3EN

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMPB07R3ENSOT1220-2DFN2020M-67.24241 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934662428125112601235Dongguan, China; Hsin-chu, Taiwan; Kwai Chung, Hong Kong 
934662428184212601235Kwai Chung, Hong Kong; Dongguan, China; Hsin-chu, Taiwan 
934662428115212601235Hsin-chu, Taiwan; Dongguan, China; Kwai Chung, Hong Kong 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001161.000000.01602
FillerSilver (Ag)7440-22-40.0974484.000001.34541
PolymerBismaleimidodiphenylmethane resin 0.0116010.000000.16017
Isobornyl Methacrylate7534-94-30.005805.000000.08008
subTotal0.11600100.000001.60168
DieDoped siliconSilicon (Si)7440-21-30.63400100.000008.75399
subTotal0.63400100.000008.75399
Lead FrameCopper alloyCopper (Cu)7440-50-82.6919895.6300037.16973
Magnesium (Mg)7439-95-40.004220.150000.05830
Nickel (Ni)7440-02-00.083892.980001.15827
Silicon (Si)7440-21-30.018300.650000.25264
Pure metal layerGold (Au)7440-57-50.000280.010000.00389
Nickel (Ni)7440-02-00.015480.550000.21378
Palladium (Pd)7440-05-30.000840.030000.01166
subTotal2.81500100.0000038.86827
Mould CompoundFillerSilica -amorphous-7631-86-90.8277723.0000011.42948
Silica fused60676-86-02.1594060.0000029.81604
Flame retardantMetal hydroxideProprietary0.107973.000001.49080
ImpurityBismuth (Bi)7440-69-90.018000.500000.24847
PigmentCarbon black1333-86-40.018000.500000.24847
PolymerEpoxy resin systemProprietary0.251937.000003.47854
Phenolic resinProprietary0.215946.000002.98160
subTotal3.59900100.0000049.69340
WireImpurityNon hazardousProprietary0.000010.010000.00011
Pure metalCopper (Cu)7440-50-80.0784199.990001.08261
subTotal0.07841100.000001.08272
total7.24241100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.