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Chemical content PMPB08R5XN

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Type numberPackagePackage descriptionTotal product weight
PMPB08R5XNSOT1220-2DFN2020M-67.19375 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934662427115212601235Kuching Sarawak, Malaysia; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001161.000000.01613
FillerSilver (Ag)7440-22-40.0974484.000001.35451
PolymerBismaleimidodiphenylmethane resin 0.0116010.000000.16125
Isobornyl Methacrylate7534-94-30.005805.000000.08063
subTotal0.11600100.000001.61252
DieDoped siliconSilicon (Si)7440-21-30.59200100.000008.22937
subTotal0.59200100.000008.22937
Lead FrameCopper alloyCopper (Cu)7440-50-82.6919895.6300037.42116
Magnesium (Mg)7439-95-40.004220.150000.05870
Nickel (Ni)7440-02-00.083892.980001.16611
Silicon (Si)7440-21-30.018300.650000.25435
Pure metal layerGold (Au)7440-57-50.000280.010000.00391
Nickel (Ni)7440-02-00.015480.550000.21522
Palladium (Pd)7440-05-30.000840.030000.01174
subTotal2.81500100.0000039.13119
Mould CompoundFillerSilica -amorphous-7631-86-90.8277723.0000011.50679
Silica fused60676-86-02.1594060.0000030.01772
Flame retardantMetal hydroxideProprietary0.107973.000001.50089
ImpurityBismuth (Bi)7440-69-90.018000.500000.25015
PigmentCarbon black1333-86-40.018000.500000.25015
PolymerEpoxy resin systemProprietary0.251937.000003.50207
Phenolic resinProprietary0.215946.000003.00177
subTotal3.59900100.0000050.02954
WireImpurityNon hazardousProprietary0.000010.010000.00010
Pure metalCopper (Cu)7440-50-80.0717499.990000.99728
subTotal0.07175100.000000.99738
total7.19375100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.