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Chemical content PMPB08R6EN

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMPB08R6ENSOT1220-2DFN2020M-67.18315 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934661978115212601235Dongguan, China; Kwai Chung, Hong Kong; Hsin-chu, Taiwan 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001161.000000.01615
FillerSilver (Ag)7440-22-40.0974484.000001.35651
PolymerBismaleimidodiphenylmethane resin 0.0116010.000000.16149
Isobornyl Methacrylate7534-94-30.005805.000000.08074
subTotal0.11600100.000001.61489
DieDoped siliconSilicon (Si)7440-21-30.57000100.000007.93524
subTotal0.57000100.000007.93524
Lead FrameCopper alloyCopper (Cu)7440-50-82.6919895.6300037.47638
Magnesium (Mg)7439-95-40.004220.150000.05878
Nickel (Ni)7440-02-00.083892.980001.16783
Silicon (Si)7440-21-30.018300.650000.25473
Pure metal layerGold (Au)7440-57-50.000280.010000.00392
Nickel (Ni)7440-02-00.015480.550000.21554
Palladium (Pd)7440-05-30.000840.030000.01176
subTotal2.81500100.0000039.18894
Mould CompoundFillerSilica -amorphous-7631-86-90.8277723.0000011.52377
Silica fused60676-86-02.1594060.0000030.06202
Flame retardantMetal hydroxideProprietary0.107973.000001.50310
ImpurityBismuth (Bi)7440-69-90.018000.500000.25052
PigmentCarbon black1333-86-40.018000.500000.25052
PolymerEpoxy resin systemProprietary0.251937.000003.50724
Phenolic resinProprietary0.215946.000003.00620
subTotal3.59900100.0000050.10337
WireImpurityNon hazardousProprietary0.000010.010000.00012
Pure metalCopper (Cu)7440-50-80.0831499.990001.15747
subTotal0.08315100.000001.15759
total7.18315100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.