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Chemical content PMPB12R7EP

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMPB12R7EPSOT1220-2DFN2020M-67.20305 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934662612115412601235Hsin-chu, Taiwan; Dongguan, China; Manchester, United Kingdom 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001161.000000.01610
FillerSilver (Ag)7440-22-40.0974484.000001.35276
PolymerBismaleimidodiphenylmethane resin 0.0116010.000000.16104
Isobornyl Methacrylate7534-94-30.005805.000000.08052
subTotal0.11600100.000001.61042
DieDoped siliconSilicon (Si)7440-21-30.59500100.000008.26039
subTotal0.59500100.000008.26039
Lead FrameCopper alloyCopper (Cu)7440-50-82.6919895.6300037.37284
Magnesium (Mg)7439-95-40.004220.150000.05862
Nickel (Ni)7440-02-00.083892.980001.16460
Silicon (Si)7440-21-30.018300.650000.25402
Pure metal layerGold (Au)7440-57-50.000280.010000.00391
Nickel (Ni)7440-02-00.015480.550000.21494
Palladium (Pd)7440-05-30.000840.030000.01172
subTotal2.81500100.0000039.08065
Mould CompoundFillerSilica -amorphous-7631-86-90.8277723.0000011.49194
Silica fused60676-86-02.1594060.0000029.97897
Flame retardantMetal hydroxideProprietary0.107973.000001.49895
ImpurityBismuth (Bi)7440-69-90.018000.500000.24982
PigmentCarbon black1333-86-40.018000.500000.24982
PolymerEpoxy resin systemProprietary0.251937.000003.49755
Phenolic resinProprietary0.215946.000002.99790
subTotal3.59900100.0000049.96495
WireImpurityNon hazardousProprietary0.000010.010000.00011
Pure metalCopper (Cu)7440-50-80.0780499.990001.08346
subTotal0.07805100.000001.08357
total7.20305100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.