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Chemical content PMPB12UNE

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Type numberPackagePackage descriptionTotal product weight
PMPB12UNESOT1220SOT12207.23492 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934068839115512601235Dongguan, China; Kuching Sarawak, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000701.000000.00968
FillerSilver (Ag)7440-22-40.0588084.000000.81272
PolymerBismaleimidodiphenylmethane resin 0.0070010.000000.09675
Isobornyl Methacrylate7534-94-30.003505.000000.04838
subTotal0.07000100.000000.96753
DieDoped siliconSilicon (Si)7440-21-30.31000100.000004.28477
subTotal0.31000100.000004.28477
Lead FrameCopper alloyCopper (Cu)7440-50-82.7049193.5956037.38691
Magnesium (Mg)7439-95-40.004220.145900.05828
Nickel (Ni)7440-02-00.084352.918801.16592
Silicon (Si)7440-21-30.018280.632400.25261
Pure metal layerGold (Au)7440-57-50.000960.033300.01330
Nickel (Ni)7440-02-00.074012.561001.02300
Palladium (Pd)7440-05-30.003270.113000.04514
subTotal2.89000100.0000039.94516
Mould CompoundFillerSilica -amorphous-7631-86-90.8579023.0000011.85777
Silica fused60676-86-02.2380060.0000030.93331
Flame retardantMetal hydroxideProprietary0.111903.000001.54667
ImpurityBismuth (Bi)7440-69-90.018650.500000.25778
PigmentCarbon black1333-86-40.018650.500000.25778
PolymerEpoxy resin systemProprietary0.261107.000003.60889
Phenolic resinProprietary0.223806.000003.09333
subTotal3.73000100.0000051.55553
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00011
Non hazardousProprietary0.000090.055500.00130
Tin solderTin (Sn)7440-31-50.1699099.940002.34831
subTotal0.17000100.000002.34972
WireImpurityNon hazardousProprietary0.000010.010000.00009
Pure metalCopper (Cu)7440-50-80.0649299.990000.89729
subTotal0.06493100.000000.89738
total7.23492100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.