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Chemical content PMPB12UNEA

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Type numberPackagePackage descriptionTotal product weight
PMPB12UNEASOT1220SOT12207.21952 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934070923115312601235Kuching Sarawak, Malaysia; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000701.000000.00970
FillerSilver (Ag)7440-22-40.0588084.000000.81446
PolymerBismaleimidodiphenylmethane resin 0.0070010.000000.09696
Isobornyl Methacrylate7534-94-30.003505.000000.04848
subTotal0.07000100.000000.96960
DieAluminium alloyAluminium (Al)7429-90-50.000870.280000.01202
Doped siliconSilicon (Si)7440-21-30.3091399.720004.28189
subTotal0.31000100.000004.29391
Lead FrameCopper alloyCopper (Cu)7440-50-82.7049193.5956037.46666
Magnesium (Mg)7439-95-40.004220.145900.05840
Nickel (Ni)7440-02-00.084352.918801.16841
Silicon (Si)7440-21-30.018280.632400.25315
Pure metal layerGold (Au)7440-57-50.000960.033300.01333
Nickel (Ni)7440-02-00.074012.561001.02518
Palladium (Pd)7440-05-30.003270.113000.04523
subTotal2.89000100.0000040.03036
Mould CompoundFillerSilica -amorphous-7631-86-90.8579023.0000011.88306
Silica fused60676-86-02.2380060.0000030.99929
Flame retardantMetal hydroxideProprietary0.111903.000001.54996
ImpurityBismuth (Bi)7440-69-90.018650.500000.25833
PigmentCarbon black1333-86-40.018650.500000.25833
PolymerEpoxy resin systemProprietary0.261107.000003.61658
Phenolic resinProprietary0.223806.000003.09993
subTotal3.73000100.0000051.66548
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00011
Non hazardousProprietary0.000090.055500.00131
Tin solderTin (Sn)7440-31-50.1699099.940002.35331
subTotal0.17000100.000002.35473
WireImpurityNon hazardousProprietary0.000000.010000.00007
Pure metalCopper (Cu)7440-50-80.0495299.990000.68592
subTotal0.04953100.000000.68599
total7.21952100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.