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Chemical content PMPB13UP

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Type numberPackagePackage descriptionTotal product weight
PMPB13UPSOT1220SOT12207.42789 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934661165115212601235Hsin-chu, Taiwan; Dongguan, China; Manchester, United Kingdom 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000701.000000.00942
FillerSilver (Ag)7440-22-40.0588084.000000.79161
PolymerBismaleimidodiphenylmethane resin 0.0070010.000000.09424
Isobornyl Methacrylate7534-94-30.003505.000000.04712
subTotal0.07000100.000000.94239
DieDoped siliconSilicon (Si)7440-21-30.52000100.000007.00064
subTotal0.52000100.000007.00064
Lead FrameCopper alloyCopper (Cu)7440-50-82.7049193.5956036.41563
Magnesium (Mg)7439-95-40.004220.145900.05677
Nickel (Ni)7440-02-00.084352.918801.13563
Silicon (Si)7440-21-30.018280.632400.24605
Pure metal layerGold (Au)7440-57-50.000960.033300.01296
Nickel (Ni)7440-02-00.074012.561000.99642
Palladium (Pd)7440-05-30.003270.113000.04397
subTotal2.89000100.0000038.90743
Mould CompoundFillerSilica -amorphous-7631-86-90.8579023.0000011.54971
Silica fused60676-86-02.2380060.0000030.12969
Flame retardantMetal hydroxideProprietary0.111903.000001.50648
ImpurityBismuth (Bi)7440-69-90.018650.500000.25108
PigmentCarbon black1333-86-40.018650.500000.25108
PolymerEpoxy resin systemProprietary0.261107.000003.51513
Phenolic resinProprietary0.223806.000003.01297
subTotal3.73000100.0000050.21614
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00127
Tin solderTin (Sn)7440-31-50.1699099.940002.28730
subTotal0.17000100.000002.28867
WireImpurityNon hazardousProprietary0.000000.010000.00006
Pure metalCopper (Cu)7440-50-80.0478999.990000.64468
subTotal0.04789100.000000.64474
total7.42789100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.