×

Chemical content PMPB13XNEA

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMPB13XNEASOT1220SOT12207.40308 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934070924115312601235Kuching Sarawak, Malaysia; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000701.000000.00946
FillerSilver (Ag)7440-22-40.0588084.000000.79426
PolymerBismaleimidodiphenylmethane resin 0.0070010.000000.09456
Isobornyl Methacrylate7534-94-30.003505.000000.04728
subTotal0.07000100.000000.94556
DieDoped siliconSilicon (Si)7440-21-30.49800100.000006.72693
subTotal0.49800100.000006.72693
Lead FrameCopper alloyCopper (Cu)7440-50-82.7049193.5956036.53767
Magnesium (Mg)7439-95-40.004220.145900.05696
Nickel (Ni)7440-02-00.084352.918801.13944
Silicon (Si)7440-21-30.018280.632400.24688
Pure metal layerGold (Au)7440-57-50.000960.033300.01300
Nickel (Ni)7440-02-00.074012.561000.99976
Palladium (Pd)7440-05-30.003270.113000.04411
subTotal2.89000100.0000039.03782
Mould CompoundFillerSilica -amorphous-7631-86-90.8579023.0000011.58842
Silica fused60676-86-02.2380060.0000030.23066
Flame retardantMetal hydroxideProprietary0.111903.000001.51153
ImpurityBismuth (Bi)7440-69-90.018650.500000.25192
PigmentCarbon black1333-86-40.018650.500000.25192
PolymerEpoxy resin systemProprietary0.261107.000003.52691
Phenolic resinProprietary0.223806.000003.02307
subTotal3.73000100.0000050.38443
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00127
Tin solderTin (Sn)7440-31-50.1699099.940002.29496
subTotal0.17000100.000002.29633
WireImpurityNon hazardousProprietary0.000000.010000.00006
Pure metalCopper (Cu)7440-50-80.0450899.990000.60893
subTotal0.04508100.000000.60899
total7.40308100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.