Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMPB14XP

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMPB14XPSOT1220SOT12207.31736 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934660516184112601235
934660516115212601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000701.000000.00957
FillerSilver (Ag)7440-22-40.0588084.000000.80357
PolymerBismaleimidodiphenylmethane resin 0.0070010.000000.09566
Isobornyl Methacrylate7534-94-30.003505.000000.04783
subTotal0.07000100.000000.95663
DieDoped siliconSilicon (Si)7440-21-30.41000100.000005.60311
subTotal0.41000100.000005.60311
Lead FrameCopper alloyCopper (Cu)7440-50-82.7049193.5956036.96569
Magnesium (Mg)7439-95-40.004220.145900.05762
Nickel (Ni)7440-02-00.084352.918801.15278
Silicon (Si)7440-21-30.018280.632400.24977
Pure metal layerGold (Au)7440-57-50.000960.033300.01315
Nickel (Ni)7440-02-00.074012.561001.01147
Palladium (Pd)7440-05-30.003270.113000.04463
subTotal2.89000100.0000039.49511
Mould CompoundFillerSilica -amorphous-7631-86-90.8579023.0000011.72417
Silica fused60676-86-02.2380060.0000030.58480
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.111903.000001.52924
Ion trapping agentBismuth (Bi)7440-69-90.018650.500000.25487
PigmentCarbon black1333-86-40.018650.500000.25487
PolymerEpoxy resin systemProprietary0.261107.000003.56823
Phenolic resinProprietary0.223806.000003.05848
subTotal3.73000100.0000050.97466
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00129
Tin solderTin (Sn)7440-31-50.1699099.940002.32185
subTotal0.17000100.000002.32324
WireImpurityNon hazardousProprietary0.000000.010000.00006
Pure metalCopper (Cu)7440-50-80.0473699.990000.64723
subTotal0.04736100.000000.64729
total7.31736100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.