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Chemical content PMPB15ENE

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMPB15ENESOT1220SOT12207.38964 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934665364115112601235Manchester, United Kingdom; Sherman, United States Of America; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000701.000000.00947
FillerSilver (Ag)7440-22-40.0588084.000000.79571
PolymerBismaleimidodiphenylmethane resin 0.0070010.000000.09473
Isobornyl Methacrylate7534-94-30.003505.000000.04736
subTotal0.07000100.000000.94727
DieDoped siliconSilicon (Si)7440-21-30.47000100.000006.36026
subTotal0.47000100.000006.36026
Lead FrameCopper alloyCopper (Cu)7440-50-82.7049193.5956036.60412
Magnesium (Mg)7439-95-40.004220.145900.05706
Nickel (Ni)7440-02-00.084352.918801.14151
Silicon (Si)7440-21-30.018280.632400.24732
Pure metal layerGold (Au)7440-57-50.000960.033300.01302
Nickel (Ni)7440-02-00.074012.561001.00158
Palladium (Pd)7440-05-30.003270.113000.04419
subTotal2.89000100.0000039.10880
Mould CompoundFillerSilica -amorphous-7631-86-90.8579023.0000011.60950
Silica fused60676-86-02.2380060.0000030.28564
Flame retardantMetal hydroxideProprietary0.111903.000001.51428
ImpurityBismuth (Bi)7440-69-90.018650.500000.25238
PigmentCarbon black1333-86-40.018650.500000.25238
PolymerEpoxy resin systemProprietary0.261107.000003.53333
Phenolic resinProprietary0.223806.000003.02856
subTotal3.73000100.0000050.47607
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00128
Tin solderTin (Sn)7440-31-50.1699099.940002.29914
subTotal0.17000100.000002.30052
WireImpurityNon hazardousProprietary0.000010.010000.00008
Pure metalCopper (Cu)7440-50-80.0596499.990000.80706
subTotal0.05964100.000000.80714
total7.38964100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.