×

Chemical content PMPB15XP

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMPB15XPSOT1220SOT12207.40221 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934066615184212601235Kuching Sarawak, Malaysia; Dongguan, China 
934066615125212601235Kuching Sarawak, Malaysia; Dongguan, China 
934066615115812601235Dongguan, China; Kuching Sarawak, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000701.000000.00946
FillerSilver (Ag)7440-22-40.0588084.000000.79436
PolymerBismaleimidodiphenylmethane resin 0.0070010.000000.09457
Isobornyl Methacrylate7534-94-30.003505.000000.04728
subTotal0.07000100.000000.94567
DieDoped siliconSilicon (Si)7440-21-30.49800100.000006.72772
subTotal0.49800100.000006.72772
Lead FrameCopper alloyCopper (Cu)7440-50-82.7049193.5956036.54196
Magnesium (Mg)7439-95-40.004220.145900.05696
Nickel (Ni)7440-02-00.084352.918801.13957
Silicon (Si)7440-21-30.018280.632400.24690
Pure metal layerGold (Au)7440-57-50.000960.033300.01300
Nickel (Ni)7440-02-00.074012.561000.99988
Palladium (Pd)7440-05-30.003270.113000.04412
subTotal2.89000100.0000039.04239
Mould CompoundFillerSilica -amorphous-7631-86-90.8579023.0000011.58978
Silica fused60676-86-02.2380060.0000030.23421
Flame retardantMetal hydroxideProprietary0.111903.000001.51171
ImpurityBismuth (Bi)7440-69-90.018650.500000.25195
PigmentCarbon black1333-86-40.018650.500000.25195
PolymerEpoxy resin systemProprietary0.261107.000003.52732
Phenolic resinProprietary0.223806.000003.02342
subTotal3.73000100.0000050.39034
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00127
Tin solderTin (Sn)7440-31-50.1699099.940002.29523
subTotal0.17000100.000002.29660
WireImpurityNon hazardousProprietary0.000000.010000.00006
Pure metalCopper (Cu)7440-50-80.0442099.990000.59716
subTotal0.04421100.000000.59722
total7.40221100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.