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Chemical content PMPB16EP

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Type numberPackagePackage descriptionTotal product weight
PMPB16EPSOT1220SOT12207.42842 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934661166115212601235Manchester, United Kingdom; Dongguan, China; Hsin-chu, Taiwan 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000701.000000.00942
FillerSilver (Ag)7440-22-40.0588084.000000.79155
PolymerBismaleimidodiphenylmethane resin 0.0070010.000000.09423
Isobornyl Methacrylate7534-94-30.003505.000000.04712
subTotal0.07000100.000000.94232
DieDoped siliconSilicon (Si)7440-21-30.52000100.000007.00014
subTotal0.52000100.000007.00014
Lead FrameCopper alloyCopper (Cu)7440-50-82.7049193.5956036.41303
Magnesium (Mg)7439-95-40.004220.145900.05676
Nickel (Ni)7440-02-00.084352.918801.13555
Silicon (Si)7440-21-30.018280.632400.24603
Pure metal layerGold (Au)7440-57-50.000960.033300.01296
Nickel (Ni)7440-02-00.074012.561000.99635
Palladium (Pd)7440-05-30.003270.113000.04396
subTotal2.89000100.0000038.90464
Mould CompoundFillerSilica -amorphous-7631-86-90.8579023.0000011.54889
Silica fused60676-86-02.2380060.0000030.12754
Flame retardantMetal hydroxideProprietary0.111903.000001.50638
ImpurityBismuth (Bi)7440-69-90.018650.500000.25106
PigmentCarbon black1333-86-40.018650.500000.25106
PolymerEpoxy resin systemProprietary0.261107.000003.51488
Phenolic resinProprietary0.223806.000003.01275
subTotal3.73000100.0000050.21256
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00127
Tin solderTin (Sn)7440-31-50.1699099.940002.28714
subTotal0.17000100.000002.28851
WireImpurityNon hazardousProprietary0.000000.010000.00007
Pure metalCopper (Cu)7440-50-80.0484199.990000.65172
subTotal0.04842100.000000.65179
total7.42842100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.