Chemical content PMPB16R5XNE

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Type numberPackagePackage descriptionTotal product weight
PMPB16R5XNESOT1220-2DFN2020M-66.85800 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934662563115312601235Dongguan, China; Kuching Sarawak, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001161.000000.01691
FillerSilver (Ag)7440-22-40.0974484.000001.42082
PolymerBismaleimidodiphenylmethane resin 0.0116010.000000.16915
Isobornyl Methacrylate7534-94-30.005805.000000.08457
DieAluminium alloyAluminium (Al)7429-90-50.000870.280000.01266
Doped siliconSilicon (Si)7440-21-30.3091399.720004.50761
Lead FrameCopper alloyCopper (Cu)7440-50-82.6919895.6300039.25320
Magnesium (Mg)7439-95-40.004220.150000.06157
Nickel (Ni)7440-02-00.083892.980001.22320
Silicon (Si)7440-21-30.018300.650000.26681
Pure metal layerGold (Au)7440-57-50.000280.010000.00410
Nickel (Ni)7440-02-00.015480.550000.22576
Palladium (Pd)7440-05-30.000840.030000.01231
Mould CompoundFillerSilica -amorphous-7631-86-90.8277723.0000012.07014
Silica fused60676-86-02.1594060.0000031.48731
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.107973.000001.57437
Ion trapping agentBismuth (Bi)7440-69-90.018000.500000.26239
PigmentCarbon black1333-86-40.018000.500000.26239
PolymerEpoxy resin systemProprietary0.251937.000003.67352
Phenolic resinProprietary0.215946.000003.14873
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0175099.990000.25515
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.