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Chemical content PMPB17EP

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Type numberPackagePackage descriptionTotal product weight
PMPB17EPSOT1220-2DFN2020M-67.09654 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934664339115312601235Kuching Sarawak, Malaysia; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001161.000000.01635
FillerSilver (Ag)7440-22-40.0974484.000001.37306
PolymerBismaleimidodiphenylmethane resin 0.0116010.000000.16346
Isobornyl Methacrylate7534-94-30.005805.000000.08173
subTotal0.11600100.000001.63460
DieAluminium alloyAluminium (Al)7429-90-50.001480.280000.02091
Doped siliconSilicon (Si)7440-21-30.5285299.720007.44752
subTotal0.53000100.000007.46843
Lead FrameCopper alloyCopper (Cu)7440-50-82.6919895.6300037.93376
Magnesium (Mg)7439-95-40.004220.150000.05950
Nickel (Ni)7440-02-00.083892.980001.18208
Silicon (Si)7440-21-30.018300.650000.25784
Pure metal layerGold (Au)7440-57-50.000280.010000.00397
Nickel (Ni)7440-02-00.015480.550000.21817
Palladium (Pd)7440-05-30.000840.030000.01190
subTotal2.81500100.0000039.66722
Mould CompoundAdditiveNon hazardousProprietary0.014830.410000.20903
FillerSilica -amorphous-7631-86-90.010490.290000.14785
Silica fused60676-86-03.1169186.1500043.92150
HardenerPhenolic resinProprietary0.155214.290002.18715
PigmentCarbon black1333-86-40.006870.190000.09687
PolymerEpoxy resin systemProprietary0.313688.670004.42019
subTotal3.61800100.0000050.98259
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalCopper (Cu)7440-50-80.0175499.990000.24717
subTotal0.01754100.000000.24719
total7.09654100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.