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Chemical content PMPB20XPEA

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Type numberPackagePackage descriptionTotal product weight
PMPB20XPEASOT1220SOT12207.42508 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934070927115312601235Kuching Sarawak, Malaysia; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000701.000000.00943
FillerSilver (Ag)7440-22-40.0588084.000000.79191
PolymerBismaleimidodiphenylmethane resin 0.0070010.000000.09428
Isobornyl Methacrylate7534-94-30.003505.000000.04714
subTotal0.07000100.000000.94276
DieDoped siliconSilicon (Si)7440-21-30.52000100.000007.00329
subTotal0.52000100.000007.00329
Lead FrameCopper alloyCopper (Cu)7440-50-82.7049193.5956036.42941
Magnesium (Mg)7439-95-40.004220.145900.05679
Nickel (Ni)7440-02-00.084352.918801.13606
Silicon (Si)7440-21-30.018280.632400.24614
Pure metal layerGold (Au)7440-57-50.000960.033300.01296
Nickel (Ni)7440-02-00.074012.561000.99680
Palladium (Pd)7440-05-30.003270.113000.04398
subTotal2.89000100.0000038.92214
Mould CompoundFillerSilica -amorphous-7631-86-90.8579023.0000011.55408
Silica fused60676-86-02.2380060.0000030.14109
Flame retardantMetal hydroxideProprietary0.111903.000001.50705
ImpurityBismuth (Bi)7440-69-90.018650.500000.25118
PigmentCarbon black1333-86-40.018650.500000.25118
PolymerEpoxy resin systemProprietary0.261107.000003.51646
Phenolic resinProprietary0.223806.000003.01411
subTotal3.73000100.0000050.23515
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00127
Tin solderTin (Sn)7440-31-50.1699099.940002.28816
subTotal0.17000100.000002.28953
WireImpurityNon hazardousProprietary0.000000.010000.00006
Pure metalCopper (Cu)7440-50-80.0450899.990000.60713
subTotal0.04508100.000000.60719
total7.42508100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.