Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMPB23XNEA

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMPB23XNEASOT1220SOT12207.20403 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934660218115312601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000701.000000.00972
FillerSilver (Ag)7440-22-40.0588084.000000.81621
PolymerBismaleimidodiphenylmethane resin 0.0070010.000000.09717
Isobornyl Methacrylate7534-94-30.003505.000000.04858
subTotal0.07000100.000000.97168
DieAluminium alloyAluminium (Al)7429-90-50.000870.280000.01205
Doped siliconSilicon (Si)7440-21-30.3091399.720004.29110
subTotal0.31000100.000004.30315
Lead FrameCopper alloyCopper (Cu)7440-50-82.7049193.5956037.54722
Magnesium (Mg)7439-95-40.004220.145900.05853
Nickel (Ni)7440-02-00.084352.918801.17092
Silicon (Si)7440-21-30.018280.632400.25370
Pure metal layerGold (Au)7440-57-50.000960.033300.01336
Nickel (Ni)7440-02-00.074012.561001.02738
Palladium (Pd)7440-05-30.003270.113000.04533
subTotal2.89000100.0000040.11644
Mould CompoundFillerSilica -amorphous-7631-86-90.8579023.0000011.90861
Silica fused60676-86-02.2380060.0000031.06595
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.111903.000001.55330
Ion trapping agentBismuth (Bi)7440-69-90.018650.500000.25888
PigmentCarbon black1333-86-40.018650.500000.25888
PolymerEpoxy resin systemProprietary0.261107.000003.62436
Phenolic resinProprietary0.223806.000003.10659
subTotal3.73000100.0000051.77657
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00011
Non hazardousProprietary0.000090.055500.00131
Tin solderTin (Sn)7440-31-50.1699099.940002.35837
subTotal0.17000100.000002.35979
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalCopper (Cu)7440-50-80.0340399.990000.47236
subTotal0.03403100.000000.47241
total7.20403100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.