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Chemical content PMPB29XNEA

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Type numberPackagePackage descriptionTotal product weight
PMPB29XNEASOT1220SOT12207.19579 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934070925115312601235Kuching Sarawak, Malaysia; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000701.000000.00973
FillerSilver (Ag)7440-22-40.0588084.000000.81714
PolymerBismaleimidodiphenylmethane resin 0.0070010.000000.09728
Isobornyl Methacrylate7534-94-30.003505.000000.04864
subTotal0.07000100.000000.97279
DieAluminium alloyAluminium (Al)7429-90-50.000870.280000.01206
Doped siliconSilicon (Si)7440-21-30.3091399.720004.29601
subTotal0.31000100.000004.30807
Lead FrameCopper alloyCopper (Cu)7440-50-82.7049193.5956037.59021
Magnesium (Mg)7439-95-40.004220.145900.05860
Nickel (Ni)7440-02-00.084352.918801.17226
Silicon (Si)7440-21-30.018280.632400.25399
Pure metal layerGold (Au)7440-57-50.000960.033300.01337
Nickel (Ni)7440-02-00.074012.561001.02856
Palladium (Pd)7440-05-30.003270.113000.04538
subTotal2.89000100.0000040.16237
Mould CompoundFillerSilica -amorphous-7631-86-90.8579023.0000011.92225
Silica fused60676-86-02.2380060.0000031.10152
Flame retardantMetal hydroxideProprietary0.111903.000001.55508
ImpurityBismuth (Bi)7440-69-90.018650.500000.25918
PigmentCarbon black1333-86-40.018650.500000.25918
PolymerEpoxy resin systemProprietary0.261107.000003.62851
Phenolic resinProprietary0.223806.000003.11015
subTotal3.73000100.0000051.83587
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00011
Non hazardousProprietary0.000090.055500.00131
Tin solderTin (Sn)7440-31-50.1699099.940002.36108
subTotal0.17000100.000002.36250
WireImpurityNon hazardousProprietary0.000000.010000.00004
Pure metalCopper (Cu)7440-50-80.0257899.990000.35833
subTotal0.02579100.000000.35837
total7.19579100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.