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Chemical content PMPB30XPE

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMPB30XPESOT1220SOT12207.35947 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934660356115112601235Hsin-chu, Taiwan; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000701.000000.00951
FillerSilver (Ag)7440-22-40.0588084.000000.79897
PolymerBismaleimidodiphenylmethane resin 0.0070010.000000.09512
Isobornyl Methacrylate7534-94-30.003505.000000.04756
subTotal0.07000100.000000.95116
DieDoped siliconSilicon (Si)7440-21-30.45000100.000006.11457
subTotal0.45000100.000006.11457
Lead FrameCopper alloyCopper (Cu)7440-50-82.7049193.5956036.75418
Magnesium (Mg)7439-95-40.004220.145900.05729
Nickel (Ni)7440-02-00.084352.918801.14619
Silicon (Si)7440-21-30.018280.632400.24834
Pure metal layerGold (Au)7440-57-50.000960.033300.01308
Nickel (Ni)7440-02-00.074012.561001.00568
Palladium (Pd)7440-05-30.003270.113000.04437
subTotal2.89000100.0000039.26913
Mould CompoundFillerSilica -amorphous-7631-86-90.8579023.0000011.65709
Silica fused60676-86-02.2380060.0000030.40980
Flame retardantMetal hydroxideProprietary0.111903.000001.52049
ImpurityBismuth (Bi)7440-69-90.018650.500000.25341
PigmentCarbon black1333-86-40.018650.500000.25341
PolymerEpoxy resin systemProprietary0.261107.000003.54781
Phenolic resinProprietary0.223806.000003.04098
subTotal3.73000100.0000050.68299
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00128
Tin solderTin (Sn)7440-31-50.1699099.940002.30856
subTotal0.17000100.000002.30994
WireImpurityNon hazardousProprietary0.000000.010000.00007
Pure metalCopper (Cu)7440-50-80.0494699.990000.67213
subTotal0.04947100.000000.67220
total7.35947100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.