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Chemical content PMPB33XN

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Type numberPackagePackage descriptionTotal product weight
PMPB33XNSOT1220 dummy POVSOT12207.07691 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934066869115712601235Dongguan, China; Kuching Sarawak, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000701.000000.00989
FillerSilver (Ag)7440-22-40.0588084.000000.83087
PolymerBismaleimidodiphenylmethane resin 0.0070010.000000.09891
Isobornyl Methacrylate7534-94-30.003505.000000.04946
subTotal0.07000100.000000.98913
DieAluminium alloyAluminium (Al)7429-90-50.000450.280000.00633
Doped siliconSilicon (Si)7440-21-30.1595599.720002.25454
subTotal0.16000100.000002.26087
Lead FrameCopper alloyCopper (Cu)7440-50-82.6865492.9600037.96210
Magnesium (Mg)7439-95-40.004050.140000.05717
Nickel (Ni)7440-02-00.083812.900001.18427
Silicon (Si)7440-21-30.018210.630000.25727
Pure metal layerGold (Au)7440-57-50.001440.050000.02042
Nickel (Ni)7440-02-00.087863.040001.24145
Palladium (Pd)7440-05-30.008090.280000.11434
subTotal2.89000100.0000040.83702
Mould CompoundFillerSilica -amorphous-7631-86-90.8579023.0000012.12252
Silica fused60676-86-02.2380060.0000031.62397
Flame retardantMetal hydroxideProprietary0.111903.000001.58120
ImpurityBismuth (Bi)7440-69-90.018650.500000.26353
PigmentCarbon black1333-86-40.018650.500000.26353
PolymerEpoxy resin systemProprietary0.261107.000003.68946
Phenolic resinProprietary0.223806.000003.16240
subTotal3.73000100.0000052.70661
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00011
Non hazardousProprietary0.000090.055500.00133
Tin solderTin (Sn)7440-31-50.1699099.940002.40074
subTotal0.17000100.000002.40218
WireImpurityNon hazardousProprietary0.000000.010000.00001
Pure metalGold (Au)7440-57-50.0068899.990000.09721
subTotal0.00688100.000000.09722
WirePure metalGold (Au)7440-57-50.05003100.000000.70692
subTotal0.05003100.000000.70692
total7.07691100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.