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Chemical content PMPB47XP

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMPB47XPSOT1220SOT12207.20508 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934066876115812601235Dongguan, China; Kuching Sarawak, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000701.000000.00972
FillerSilver (Ag)7440-22-40.0588084.000000.81609
PolymerBismaleimidodiphenylmethane resin 0.0070010.000000.09715
Isobornyl Methacrylate7534-94-30.003505.000000.04858
subTotal0.07000100.000000.97154
DieAluminium alloyAluminium (Al)7429-90-50.000870.280000.01205
Doped siliconSilicon (Si)7440-21-30.3091399.720004.29047
subTotal0.31000100.000004.30252
Lead FrameCopper alloyCopper (Cu)7440-50-82.7049193.5956037.54175
Magnesium (Mg)7439-95-40.004220.145900.05852
Nickel (Ni)7440-02-00.084352.918801.17075
Silicon (Si)7440-21-30.018280.632400.25366
Pure metal layerGold (Au)7440-57-50.000960.033300.01336
Nickel (Ni)7440-02-00.074012.561001.02723
Palladium (Pd)7440-05-30.003270.113000.04532
subTotal2.89000100.0000040.11059
Mould CompoundFillerSilica -amorphous-7631-86-90.8579023.0000011.90688
Silica fused60676-86-02.2380060.0000031.06142
Flame retardantMetal hydroxideProprietary0.111903.000001.55307
ImpurityBismuth (Bi)7440-69-90.018650.500000.25885
PigmentCarbon black1333-86-40.018650.500000.25885
PolymerEpoxy resin systemProprietary0.261107.000003.62383
Phenolic resinProprietary0.223806.000003.10614
subTotal3.73000100.0000051.76904
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00011
Non hazardousProprietary0.000090.055500.00131
Tin solderTin (Sn)7440-31-50.1699099.940002.35803
subTotal0.17000100.000002.35945
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalCopper (Cu)7440-50-80.0350899.990000.48690
subTotal0.03508100.000000.48695
total7.20508100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.