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Chemical content PMPB48EPA

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Type numberPackagePackage descriptionTotal product weight
PMPB48EPASOT1220SOT12207.20719 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934070933115312601235Kuching Sarawak, Malaysia; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000701.000000.00971
FillerSilver (Ag)7440-22-40.0588084.000000.81585
PolymerBismaleimidodiphenylmethane resin 0.0070010.000000.09713
Isobornyl Methacrylate7534-94-30.003505.000000.04856
subTotal0.07000100.000000.97125
DieAluminium alloyAluminium (Al)7429-90-50.000870.280000.01204
Doped siliconSilicon (Si)7440-21-30.3091399.720004.28922
subTotal0.31000100.000004.30126
Lead FrameCopper alloyCopper (Cu)7440-50-82.7049193.5956037.53076
Magnesium (Mg)7439-95-40.004220.145900.05850
Nickel (Ni)7440-02-00.084352.918801.17041
Silicon (Si)7440-21-30.018280.632400.25359
Pure metal layerGold (Au)7440-57-50.000960.033300.01335
Nickel (Ni)7440-02-00.074012.561001.02693
Palladium (Pd)7440-05-30.003270.113000.04531
subTotal2.89000100.0000040.09885
Mould CompoundFillerSilica -amorphous-7631-86-90.8579023.0000011.90339
Silica fused60676-86-02.2380060.0000031.05232
Flame retardantMetal hydroxideProprietary0.111903.000001.55262
ImpurityBismuth (Bi)7440-69-90.018650.500000.25877
PigmentCarbon black1333-86-40.018650.500000.25877
PolymerEpoxy resin systemProprietary0.261107.000003.62277
Phenolic resinProprietary0.223806.000003.10523
subTotal3.73000100.0000051.75387
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00011
Non hazardousProprietary0.000090.055500.00131
Tin solderTin (Sn)7440-31-50.1699099.940002.35734
subTotal0.17000100.000002.35876
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalCopper (Cu)7440-50-80.0371999.990000.51596
subTotal0.03719100.000000.51601
total7.20719100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.