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Chemical content PMPB50ENE

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMPB50ENESOT1220SOT12207.16456 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934660354115212601235Dongguan, China; Hsin-chu, Taiwan 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000701.000000.00977
FillerSilver (Ag)7440-22-40.0588084.000000.82071
PolymerBismaleimidodiphenylmethane resin 0.0070010.000000.09770
Isobornyl Methacrylate7534-94-30.003505.000000.04885
subTotal0.07000100.000000.97703
DieDoped siliconSilicon (Si)7440-21-30.24000100.000003.34982
subTotal0.24000100.000003.34982
Lead FrameCopper alloyCopper (Cu)7440-50-82.7049193.5956037.75407
Magnesium (Mg)7439-95-40.004220.145900.05885
Nickel (Ni)7440-02-00.084352.918801.17737
Silicon (Si)7440-21-30.018280.632400.25509
Pure metal layerGold (Au)7440-57-50.000960.033300.01343
Nickel (Ni)7440-02-00.074012.561001.03304
Palladium (Pd)7440-05-30.003270.113000.04558
subTotal2.89000100.0000040.33743
Mould CompoundFillerSilica -amorphous-7631-86-90.8579023.0000011.97422
Silica fused60676-86-02.2380060.0000031.23709
Flame retardantMetal hydroxideProprietary0.111903.000001.56185
ImpurityBismuth (Bi)7440-69-90.018650.500000.26031
PigmentCarbon black1333-86-40.018650.500000.26031
PolymerEpoxy resin systemProprietary0.261107.000003.64433
Phenolic resinProprietary0.223806.000003.12371
subTotal3.73000100.0000052.06182
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00011
Non hazardousProprietary0.000090.055500.00132
Tin solderTin (Sn)7440-31-50.1699099.940002.37137
subTotal0.17000100.000002.37280
WireImpurityNon hazardousProprietary0.000010.010000.00009
Pure metalCopper (Cu)7440-50-80.0645599.990000.90096
subTotal0.06456100.000000.90105
total7.16456100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.