×

Chemical content PMST2907A

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMST2907ASOT323SC-705.55596 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340445801151112601235D-22529 HAMBURG, Germany; Seremban, Malaysia; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.07000100.000001.25991
subTotal0.07000100.000001.25991
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.001660.090000.02997
Carbon (C)7440-44-00.000740.040000.01332
Chromium (Cr)7440-47-30.001660.090000.02997
Cobalt (Co)7440-48-40.007960.430000.14318
Iron (Fe)7439-89-60.8260244.6500014.86737
Manganese (Mn)7439-96-50.012760.690000.22975
Nickel (Ni)7440-02-00.6389934.5400011.50098
Phosphorus (P)7723-14-00.000370.020000.00666
Silicon (Si)7440-21-30.004810.260000.08657
Sulphur (S)7704-34-90.000370.020000.00666
Pure metal layerCopper (Cu)7440-50-80.3117216.850005.61064
Silver (Ag)7440-22-40.042922.320000.77250
subTotal1.85000100.0000033.29757
Mould CompoundFillerSilica fused60676-86-02.5534075.1000045.95785
PigmentCarbon black1333-86-40.010200.300000.18359
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.5950017.5000010.70922
Phenol Formaldehyde resin (generic)9003-35-40.241407.100004.34488
subTotal3.40000100.0000061.19554
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00012
Bismuth (Bi)7440-69-90.000000.001000.00004
Copper (Cu)7440-50-80.000000.001000.00004
Lead (Pb)7439-92-10.000010.005000.00021
Tin solderTin (Sn)7440-31-50.2299899.990004.13928
subTotal0.23000100.000004.13969
WirePure metalCopper (Cu)7440-50-80.00596100.000000.10727
subTotal0.00596100.000000.10727
total5.55596100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.