Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMT200EPE

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

12NC OPN Type No. Package State MSL
934660521115PMT200EPEXPMT200EPESOT223 (SC-73)RFS1
REACHCompliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHSCompliant with Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products) (CN RoHS) without exemptions.
ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFASDoes not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 1333-86-4: 237 ppm; substance 7439-92-1: <1 ppm;
IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 1333-86-4: 237 ppm; substance 7439-92-1: <1 ppm;
Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 4557 ppm;
RHF IndicatorLead-free and halogen-free according to Nexperia's halogen-free definition.
RHF-2006 indicator DEU/CN RoHS compliantHalogen-free
Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
AdhesiveFillerSilver (Ag)7440-22-40.10010077.0000000.097384
AdhesivePolymerResin system0.02990023.0000000.029088
Adhesive Total0.130000100.0000000.126472
DieDoped siliconSilicon (Si)7440-21-30.470000100.0000000.457246
Die Total0.470000100.0000000.457246
Lead FrameCopper alloyCopper (Cu)7440-50-850.72514099.15000049.348640
Lead FrameCopper alloyIron (Fe)7439-89-60.0511600.1000000.049772
Lead FrameCopper alloyPhosphorus (P)7723-14-00.0153480.0300000.014931
Base Alloy C19210 Total50.79164899.28000049.413343
Lead FramePure metal layerSilver (Ag)7440-22-40.3683520.7200000.358356
Pre-Plating Total0.3683520.7200000.358356
Lead Frame Total51.160000100.00000049.771699
Mould CompoundFillerSilica7631-86-935.12880072.00000034.175529
Mould CompoundPolymero-Cresol-epichlorohydrin-formaldehyde copolymer29690-82-27.31850015.0000007.119902
Mould CompoundPolymerFormaldehyde-phenol copolymer9003-35-44.87900010.0000004.746601
Mould CompoundAdditiveNon-declarable1.4149102.9000001.376515
Mould CompoundPigmentCarbon black1333-86-40.0243950.0500000.023733
Mould CompoundAdditiveTriphenylphosphine603-35-00.0243950.0500000.023733
Mould Compound Total48.790000100.00000047.466013
Post-PlatingTin solderTin (Sn)7440-31-52.20867499.9400002.148738
Post-PlatingImpurityNon-declarable0.0012270.0555000.001194
Post-PlatingImpurityLead (Pb)7439-92-10.0000990.0045000.000096
Post-Plating Total2.210000100.0000002.150028
WirePure metalCopper (Cu)7440-50-80.02933599.9900000.028539
WireImpurityNon-declarable0.0000030.0100000.000003
Wire Total0.029338100.0000000.028542
PMT200EPE Total102.789338100.000000
Notes
Report created on 2026-01-19 19:12:40 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
Pb-free Soldering Pb Soldering No. of Processing Cycles
PPT MPPT PPT MPPT
260 °C40 s235 °C30 s3
Notes
Report created on 2026-01-19 19:12:40 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
部件名称
Component
有毒有害物质或元素 (Toxic and hazardous substances or elements)
Pb (铅) 铅 Lead Hg (汞) 汞 Mercury Cd (镉) 镉 Cadmium Cr6+ (六价铬) 六价铬 Chromium VI PBB (多溴联苯) 多溴联苯
Polybrominated biphenyls
PBDE (多溴二苯醚) 多溴二苯醚
Polybrominated diphenyl ethers
DEHP (邻苯二甲酸二(2-乙基己)酯) 邻苯二甲酸二(2-乙基己)酯
Di(2-ethylhexyl) phthalate
BBP (邻苯二甲酸丁苄酯) 邻苯二甲酸丁苄酯
Butyl benzyl phthalate
DBP (邻苯二甲酸二丁酯) 邻苯二甲酸二丁酯
Dibutyl phthalate
DIBP (邻苯二甲酸二异丁酯) 邻苯二甲酸二异丁酯
Diisobutyl phthalate
胶黏剂 (Adhesive)
半导体芯片 (Die)
基底合金 (Base Alloy)
预镀层 (Pre-Plating)
模封料 (Mould Compound)
后镀层 (Post-Plating)
导线 (Wire)
表示该有害物质在该部件的所有均质材料中的含量均符合 GB/T 26572 规定的限量要求。
Indicates that the content of the hazardous substance in all homogeneous materials of this part complies with the limit requirements of GB/T 26572.
表示该有害物质在该部件的至少一种均质材料中的含量超过 GB/T 26572 规定的限量要求(如适用,符合相关豁免要求)。
Indicates that the content of the hazardous substance in at least one homogeneous material of this part exceeds the limit requirements of GB/T 26572 (where applicable, in accordance with relevant exemptions).
EFUP Icon 该半导体产品符合中国 RoHS 要求,适用"e"标识,环境保护使用期限(EFUP)标识不适用。
This semiconductor product complies with China RoHS requirements and bears the "e" mark; therefore, the Environmental Friendly Use Period (EFUP) marking is not applicable.
注:EFUP 的确定基于产品在正常使用条件下的环境与可靠性评估。
Note: The EFUP is determined based on environmental and reliability assessments under normal operating conditions.
Notes
Report created on 2026-01-19 19:12:40 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.