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Chemical content PMV27UPE

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Type numberPackagePackage descriptionTotal product weight
PMV27UPESOT23TO-236AB9.25222 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934068498215412601235Hsin-chu, Taiwan; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0308077.000000.33289
PolymerResin systemProprietary0.0092023.000000.09944
subTotal0.04000100.000000.43233
DieDoped siliconSilicon (Si)7440-21-30.45000100.000004.86370
subTotal0.45000100.000004.86370
Lead FrameCopper alloyCopper (Cu)7440-50-83.0968894.1300033.47172
Iron (Fe)7439-89-60.082912.520000.89609
Lead (Pb)7439-92-10.000990.030000.01067
Phosphorus (P)7723-14-00.004940.150000.05334
Zinc (Zn)7440-66-60.006250.190000.06756
Pure metal layerSilver (Ag)7440-22-40.098042.980001.05966
subTotal3.29000100.0000035.55904
Mould CompoundAdditiveNon hazardousProprietary0.020790.410000.22467
FillerSilica -amorphous-7631-86-90.014700.290000.15891
Silica fused60676-86-04.3678086.1500047.20818
HardenerPhenolic resinProprietary0.217504.290002.35082
PigmentCarbon black1333-86-40.009630.190000.10412
PolymerEpoxy resin systemProprietary0.439578.670004.75096
subTotal5.07000100.0000054.79766
Post-PlatingImpurityLead (Pb)7439-92-10.000020.004500.00017
Non hazardousProprietary0.000190.055500.00210
Tin solderTin (Sn)7440-31-50.3497999.940003.78061
subTotal0.35000100.000003.78288
WireImpurityNon hazardousProprietary0.000010.010000.00006
Pure metalCopper (Cu)7440-50-80.0522199.990000.56435
subTotal0.05222100.000000.56441
total9.25222100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.