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Chemical content PMV65XP

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Type numberPackagePackage descriptionTotal product weight
PMV65XPSOT23TO-236AB8.92892 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934058736235412601235Bangkok, Thailand; Kuching Sarawak, Malaysia; Dongguan, China; Nantong, China; Kwai Chung, Hong Kong 
9340587362151412601235Bangkok, Thailand; Nantong, China; Kwai Chung, Hong Kong; Kuching Sarawak, Malaysia; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0308077.000000.34495
PolymerResin systemProprietary0.0092023.000000.10304
subTotal0.04000100.000000.44799
DieAluminium alloyAluminium (Al)7429-90-50.000450.280000.00502
Doped siliconSilicon (Si)7440-21-30.1595599.720001.78691
subTotal0.16000100.000001.79193
Lead FrameCopper alloyCopper (Cu)7440-50-83.0968894.1300034.68367
Iron (Fe)7439-89-60.082912.520000.92853
Lead (Pb)7439-92-10.000990.030000.01105
Phosphorus (P)7723-14-00.004940.150000.05527
Zinc (Zn)7440-66-60.006250.190000.07001
Pure metal layerSilver (Ag)7440-22-40.098042.980001.09803
subTotal3.29000100.0000036.84656
Mould CompoundAdditiveNon hazardousProprietary0.020790.410000.23281
FillerSilica -amorphous-7631-86-90.014700.290000.16467
Silica fused60676-86-04.3678086.1500048.91751
HardenerPhenolic resinProprietary0.217504.290002.43594
PigmentCarbon black1333-86-40.009630.190000.10789
PolymerEpoxy resin systemProprietary0.439578.670004.92298
subTotal5.07000100.0000056.78180
Post-PlatingImpurityLead (Pb)7439-92-10.000020.004500.00018
Non hazardousProprietary0.000190.055500.00218
Tin solderTin (Sn)7440-31-50.3497999.940003.91750
subTotal0.35000100.000003.91986
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalCopper (Cu)7440-50-80.0189299.990000.21192
subTotal0.01892100.000000.21194
total8.92892100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.