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Chemical content PMV90ENE

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Type numberPackagePackage descriptionTotal product weight
PMV90ENESOT23TO-236AB8.90764 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934068847215312601235Hsin-chu, Taiwan; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0308077.000000.34577
PolymerResin systemProprietary0.0092023.000000.10328
subTotal0.04000100.000000.44905
DieDoped siliconSilicon (Si)7440-21-30.15000100.000001.68395
subTotal0.15000100.000001.68395
Lead FrameCopper alloyCopper (Cu)7440-50-83.0968894.1300034.76653
Iron (Fe)7439-89-60.082912.520000.93075
Lead (Pb)7439-92-10.000990.030000.01108
Phosphorus (P)7723-14-00.004940.150000.05540
Zinc (Zn)7440-66-60.006250.190000.07018
Pure metal layerSilver (Ag)7440-22-40.098042.980001.10065
subTotal3.29000100.0000036.93459
Mould CompoundAdditiveNon hazardousProprietary0.020790.410000.23336
FillerSilica -amorphous-7631-86-90.014700.290000.16506
Silica fused60676-86-04.3678086.1500049.03437
HardenerPhenolic resinProprietary0.217504.290002.44176
PigmentCarbon black1333-86-40.009630.190000.10814
PolymerEpoxy resin systemProprietary0.439578.670004.93474
subTotal5.07000100.0000056.91743
Post-PlatingImpurityLead (Pb)7439-92-10.000020.004500.00018
Non hazardousProprietary0.000190.055500.00218
Tin solderTin (Sn)7440-31-50.3497999.940003.92685
subTotal0.35000100.000003.92921
WireImpurityNon hazardousProprietary0.000000.010000.00001
Pure metalCopper (Cu)7440-50-80.0076499.990000.08576
subTotal0.00764100.000000.08577
total8.90764100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.