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Chemical content PMXB360ENEA

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMXB360ENEASOT1215DFN1010D-31.26826 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934067475147412601235Manchester, United Kingdom; Sherman, United States Of America; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000301.000000.02365
FillerSilver (Ag)7440-22-40.0252084.000001.98697
PolymerBismaleimidodiphenylmethane resin 0.0030010.000000.23654
Isobornyl Methacrylate7534-94-30.001505.000000.11827
subTotal0.03000100.000002.36543
DieDoped siliconSilicon (Si)7440-21-30.16000100.0000012.61571
subTotal0.16000100.0000012.61571
Lead FrameCopper alloyChromium (Cr)7440-47-30.001270.240000.10029
Copper (Cu)7440-50-80.5009094.5100039.49529
Tin (Sn)7440-31-50.001270.240000.10029
Zinc (Zn)7440-66-60.001110.210000.08776
Pure metal layerGold (Au)7440-57-50.000370.070000.02925
Nickel (Ni)7440-02-00.022954.330001.80949
Palladium (Pd)7440-05-30.002120.400000.16716
subTotal0.53000100.0000041.78953
Mould CompoundFillerSilica -amorphous-7631-86-90.1173023.000009.24889
Silica fused60676-86-00.3060060.0000024.12754
Flame retardantMetal hydroxideProprietary0.015303.000001.20638
ImpurityBismuth (Bi)7440-69-90.002550.500000.20106
PigmentCarbon black1333-86-40.002550.500000.20106
PolymerEpoxy resin systemProprietary0.035707.000002.81488
Phenolic resinProprietary0.030606.000002.41275
subTotal0.51000100.0000040.21256
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00011
Non hazardousProprietary0.000020.055500.00131
Tin solderTin (Sn)7440-31-50.0299899.940002.36403
subTotal0.03000100.000002.36545
WireImpurityNon hazardousProprietary0.000000.010000.00007
Pure metalGold (Au)7440-57-50.0082699.990000.65091
subTotal0.00826100.000000.65098
total1.26826100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.