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Chemical content PMXB75UPE

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMXB75UPESOT1215DFN1010D-31.28783 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934067153147412601235Dongguan, China; Kuching Sarawak, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000301.000000.02330
FillerSilver (Ag)7440-22-40.0252084.000001.95678
PolymerBismaleimidodiphenylmethane resin 0.0030010.000000.23295
Isobornyl Methacrylate7534-94-30.001505.000000.11648
subTotal0.03000100.000002.32951
DieDoped siliconSilicon (Si)7440-21-30.16000100.0000012.42400
subTotal0.16000100.0000012.42400
Lead FrameCopper alloyChromium (Cr)7440-47-30.001270.240000.09877
Copper (Cu)7440-50-80.5009094.5100038.89512
Tin (Sn)7440-31-50.001270.240000.09877
Zinc (Zn)7440-66-60.001110.210000.08642
Pure metal layerGold (Au)7440-57-50.000370.070000.02881
Nickel (Ni)7440-02-00.022954.330001.78199
Palladium (Pd)7440-05-30.002120.400000.16462
subTotal0.53000100.0000041.15450
Mould CompoundFillerSilica -amorphous-7631-86-90.1173023.000009.10835
Silica fused60676-86-00.3060060.0000023.76090
Flame retardantMetal hydroxideProprietary0.015303.000001.18805
ImpurityBismuth (Bi)7440-69-90.002550.500000.19801
PigmentCarbon black1333-86-40.002550.500000.19801
PolymerEpoxy resin systemProprietary0.035707.000002.77211
Phenolic resinProprietary0.030606.000002.37609
subTotal0.51000100.0000039.60152
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000020.055500.00129
Tin solderTin (Sn)7440-31-50.0299899.940002.32810
subTotal0.03000100.000002.32949
WireImpurityNon hazardousProprietary0.000000.010000.00022
Pure metalGold (Au)7440-57-50.0278399.990002.16094
subTotal0.02783100.000002.16116
total1.28783100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.