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Chemical content PMZ950UPE

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMZ950UPESOT883XQFN30.85732 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934068445315412601235Dongguan, China; Hsin-chu, Taiwan 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.88648
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.12212
Phenolic resinProprietary0.0013513.530000.15782
subTotal0.01000100.000001.16642
DieDoped siliconSilicon (Si)7440-21-30.03000100.000003.49928
subTotal0.03000100.000003.49928
Lead FrameCopper alloyCopper (Cu)7440-50-80.4016693.4100046.85100
Magnesium (Mg)7439-95-40.000630.146000.07323
Nickel (Ni)7440-02-00.012532.913001.46105
Silicon (Si)7440-21-30.002710.631000.31649
MetallisationGold (Au)7440-57-50.000150.035000.01755
Nickel (Ni)7440-02-00.011852.755001.38181
Palladium (Pd)7440-05-30.000470.110000.05517
subTotal0.43000100.0000050.15630
Mould CompoundFillerSilica -amorphous-7631-86-90.0851023.000009.92628
Silica fused60676-86-00.2220060.0000025.89465
Flame retardantMetal hydroxideProprietary0.011103.000001.29473
ImpurityBismuth (Bi)7440-69-90.001850.500000.21579
PigmentCarbon black1333-86-40.001850.500000.21579
PolymerEpoxy resin systemProprietary0.025907.000003.02104
Phenolic resinProprietary0.022206.000002.58946
subTotal0.37000100.0000043.15774
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00005
Non hazardousProprietary0.000010.055500.00065
Tin solderTin (Sn)7440-31-50.0099999.940001.16573
subTotal0.01000100.000001.16643
WireImpurityNon hazardousProprietary0.000000.010000.00009
Pure metalGold (Au)7440-57-50.0073299.990000.85374
subTotal0.00732100.000000.85383
total0.85732100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.